Description
Product Introduction
GF-01 Thermal Gel is an ultra-soft, high thermal conductivity thermal interface material designed for advanced electronic heat dissipation applications. Compared with traditional thermal grease and phase-change materials, it offers improved formulation stability, lower volatility, and reduced material spillage, ensuring long-term reliable performance in demanding operating environments.
With a thermal conductivity of ≥ 6.5 W/m·K and excellent electrical insulation properties, GF-01 delivers efficient heat transfer while maintaining strong dielectric safety. The gel features a highly deformable structure that allows it to conform closely to uneven surfaces, significantly reducing thermal resistance between heat-generating components and heat sinks.
The material is silicone-free, non-toxic, odorless, and non-corrosive. It does not require mixing before use and can be directly dispensed or applied, offering excellent processing convenience. During long-term operation, it shows no oil separation and generates minimal internal stress, ensuring stable device performance over time.
Product Features
Thermal conductivity ≥ 6.5 W/m·K
Ultra-soft gel with excellent deformability
High breakdown voltage ≥ 10 KV/mm
Low volatility and no oil separation during long-term use
Silicone-free formulation
No mixing required, easy dispensing or coating application
Excellent creep resistance
Non-toxic, odorless, and non-corrosive
Stable performance under wide temperature conditions
Applications
GF-01 Thermal Gel is suitable for a wide range of thermal management applications, including:
Semiconductor chips and heat sink systems
LED lighting and luminaires
Automotive electronics and consumer electronics
High-performance CPUs and GPU processors
Dispensing or coating applications with various thickness requirements
Product Parameters
Color: Light blue
Flow Rate (30cc EFD cartridges, 0.100” orifice, 90psi): 10–18 g/min
Specific Gravity: 3.3 ± 0.1 g/cm³
Volume Resistivity: >10¹¹ Ω·cm
Thermal Conductivity: 6.5 W/m·K
Breakdown Voltage: ≥ 10 KV/mm
Minimum BLT Thickness: 0.15 mm
Operating Temperature Range: -50°C to 280°C
Shelf Life: 12 months
Siloxane Volatiles (D4–D20): < 0.01%
Coefficient of Thermal Expansion: 200 ppm/K
Flammability Rating: UL94 V-0
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